METHOD AND APPARATUS FOR CONTROLLING WAFER UNIFORMITY IN A CHEMICAL MECHANICAL POLISHING TOOL USING CARRIER HEAD SIGNATURES

Title:

METHOD AND APPARATUS FOR CONTROLLING WAFER UNIFORMITY IN A CHEMICAL MECHANICAL POLISHING TOOL USING CARRIER HEAD SIGNATURES

Document Type and Number:

WIPO Patent Application WO2002011198

Kind Code:

A3

Abstract:

A method for controlling wafer uniformity in a polishing tool (20) includes providing a plurality of carrier heads (40), determining a signature for each of the carrier heads (40), and installing carrier heads (40) with similar signatures in a polishing tool. A processing line includes a polishing tool (20) and a processing tool (120). The polishing tool (20) is adapted to polish wafers. The polishing tool (20) includes a plurality of carrier heads (40), each carrier head (40) having a polishing signature similar to the other carrier heads (40). The processing tool (20) is adapted to process the polished wafers in accordance with a recipe. At least one parameter in the recipe is based on the polishing signatures of the carrier heads (40).

Inventors:

CAMPBELL WILLIAM J

Application Number:

PCT/US2001/021142

Publication Date:

April 11, 2002

Filing Date:

July 03, 2001

Export Citation:

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Assignee:

ADVANCED MICRO DEVICES INC (US)

International Classes:

B24B41/06; B24B49/00; (IPC1-7): B24B37/04; B24B49/00; B24B41/06

Foreign References:

EP0827193A2	1998-03-04
EP0951963A2	1999-10-27
US5609719A	1997-03-11
EP0727807A1	1996-08-21

Other References: