Title:
METHOD AND APPARATUS FOR CUTTING CABLE INSULATING FILM USING LASER BEAM
Document Type and Number:
WIPO Patent Application WO/2011/055785
Kind Code:
A1
Abstract:
Disclosed is a method and an apparatus for cutting a cable insulating film using a laser beam, wherein laser beams (L1, L2) applied in the vertical direction toward a cable (W) extending in the front-rear direction are moved by displacing the beams not only in the cable traversing direction (horizontal direction) but also in the vertical direction such that the focal point (F) of the laser beams (L1, L2) moves in the circumferential direction along the outer circumferential surface of the cable (W). Thus, since the insulating film of the cable (W) can be always positioned within the effective range for being cut by means of thermal energy, said effective range being in the laser beams (L1, L2), the insulating film of the cable (W) having a radius larger than the effective range of the laser beams (L1, L2) can be reliably cut.
Inventors:
IGARASHI SHINICHI (JP)
Application Number:
PCT/JP2010/069699
Publication Date:
May 12, 2011
Filing Date:
November 05, 2010
Export Citation:
Assignee:
JAPAN AUTOMATIC MACHINE CO LTD (JP)
IGARASHI SHINICHI (JP)
IGARASHI SHINICHI (JP)
International Classes:
H02G1/12; B23K26/00; B23K26/38
Foreign References:
| JP2007143280A | 2007-06-07 | |||
| JP2007151345A | 2007-06-14 | |||
| JP2001210149A | 2001-08-03 | |||
| JPH02197206A | 1990-08-03 |
Attorney, Agent or Firm:
KATSUNUMA Hirohito et al. (JP)
Katsunuma Hirohito (JP)
Katsunuma Hirohito (JP)
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