Title:
METHOD AND APPARATUS FOR DETERMINING ACCEPTANCE/REJECTION OF FINE DIAMETER WIRE BONDING
Document Type and Number:
WIPO Patent Application WO/2011/114945
Kind Code:
A1
Abstract:
Disclosed are a method and an apparatus for determining acceptance/rejection of fine diameter wire bonding of semiconductor devices, LED devices, and the like at a high accuracy without contact, said acceptance/rejection having not been determined by conventional image inspecting methods and the like. The apparatus is configured of: a heating laser device (1) which spot-heats the bonding portion of the fine diameter wire; a two-wavelength infrared radiation thermometer (2), which corrects an emissivity and measures a temperature at a high speed on the basis of a minute amount of infrared rays radiated from the heated portion of the fine diameter wire; and a correcting/determining means (4), which corrects the measurement results obtained from the two-wavelength infrared radiation thermometer (2) to a temperature change with reference heating power, then determines acceptance/rejection of the bonding by comparing the corrected temperature change or a value correlated to a bonding area obtained on the basis of the corrected temperature change with a temperature change indicated by an acceptable reference product having the temperature change corrected with the reference heating power or a value correlated to a bonding area obtained on the basis of the temperature change indicated by the acceptable reference product.
Inventors:
MATSUMOTO Jun (Ltd. 290-1 Shimoakasaka, Kawagoe-sh, Saitama 55, 〒3501155, JP)
Application Number:
JP2011/055367
Publication Date:
September 22, 2011
Filing Date:
March 08, 2011
Export Citation:
Assignee:
Joyo Machine Co.,Ltd. (23-21, Renjaku-cho Kawagoe-sh, Saitama 66, 〒3500066, JP)
常陽機械株式会社 (〒66 埼玉県川越市連雀町２３－２１ Saitama, 〒3500066, JP)
常陽機械株式会社 (〒66 埼玉県川越市連雀町２３－２１ Saitama, 〒3500066, JP)
International Classes:
G01N25/72; B23K1/00; H01L21/66; H05K3/34
Attorney, Agent or Firm:
SAITOH Haruo (8th Floor Kyobashi Yayoi Building, 11-6 Kyobashi 2-chome, Chuo-k, Tokyo 31, 〒1040031, JP)
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Claims: