Title:
METHOD AND APPARATUS FOR ELECTRODEPOSITION OR ETCHING OF UNIFORM FILM WITH MINIMAL EDGE EXCLUSION ON SUBSTRATE
Document Type and Number:
WIPO Patent Application WO2002057514
Kind Code:
A3
Abstract:
A system for depositing materials on a surface of a wafer includes an anode, a shaping plate, a liquid electrolyte contained between the anode and the surface of the wafer, and electrical contact members contacting selected locations on the surface of the wafer. The shaping plate defines a recessed edge and is supported between the anode and the surface of the wafer such that an upper surface of the shaping plate faces the surface of the substrate. The shaping plate can have a plurality of channels such that each puts the surface of the wafer in a fluid communication with the anode. The deposition process progresses through the shaping plate. The upper surface of the shaping plate has a substantially larger area than the area of the surface of the wafer. The electrical contact members contact the selected locations on the surface of the wafer through the recessed edge of the shaping plate such that when the wafer is rotated, the selected contact locations move over the shaping plate and are plated under an applied potential.
More Like This:
Inventors:
BASOL BULENT M
UZOH CYPRIAN
TALIEH HOMAYOUN
UZOH CYPRIAN
TALIEH HOMAYOUN
Application Number:
PCT/US2001/051158
Publication Date:
February 06, 2003
Filing Date:
November 02, 2001
Export Citation:
Assignee:
NUTOOL INC (US)
International Classes:
C25D7/12; C25D17/00; C25D17/08; C25D21/00; H01L21/288; H01L21/768; H01L21/321; (IPC1-7): C25D5/02; C25D5/08; C25D17/00; C25F7/00
Foreign References:
| US6132587A | 2000-10-17 | |||
| US6001235A | 1999-12-14 | |||
| US5976331A | 1999-11-02 | |||
| EP1037263A2 | 2000-09-20 |
Download PDF: