Title:
METHOD AND APPARATUS FOR FINAL POLISHING OF SILICON WAFER
Document Type and Number:
WIPO Patent Application WO/2020/135498
Kind Code:
A1
Abstract:
Provided are a method and apparatus for final polishing of a silicon wafer. The method for final polishing comprises: during final polishing to the remaining predetermined time, using both polishing slurry and an oxidizing solution as a polishing liquid to form a hydrophilic silicon oxide film on the surface of a silicon wafer.
Inventors:
ZHENG JIAZHEN (CN)
Application Number:
PCT/CN2019/128276
Publication Date:
July 02, 2020
Filing Date:
December 25, 2019
Export Citation:
Assignee:
XUZHOU XINJING SEMICONDUCTOR TECH CO LTD (CN)
International Classes:
B24B37/04; H01L21/304
Foreign References:
| CN109648451A | 2019-04-19 | |||
| US5616212A | 1997-04-01 | |||
| JP2000173958A | 2000-06-23 | |||
| CN1133904A | 1996-10-23 | |||
| CN108885986A | 2018-11-23 |
Attorney, Agent or Firm:
TSINGYIHUA INTELLECTUAL PROPERTY LLC (CN)
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