Title:
METHOD AND APPARATUS FOR FORMING BUFFER LAYERS
Document Type and Number:
WIPO Patent Application WO2001026165
Kind Code:
A9
Abstract:
Methods and apparatus for depositing buffer layers for superconducting articles are provided. Substrate having residual oxide coating is cleaned by interaction with ions, the substrate is resistively heated to a temperature suitable for maintaining acceptable biaxial texture, and buffer material is deposited by sputter-deposition. The deposition methods are suitable for preparing buffer-coated substrates in the form of a tape or wire with lengths substantially in excess of a meter.
Inventors:
BUCZEK DAVID M
ANNAVARAPU SURESH
FRITZEMEIER LESLIE G
CAMERON ROBERT D
CUI XINGTIAN
ANNAVARAPU SURESH
FRITZEMEIER LESLIE G
CAMERON ROBERT D
CUI XINGTIAN
Application Number:
PCT/US2000/040391
Publication Date:
January 30, 2003
Filing Date:
July 14, 2000
Export Citation:
Assignee:
AMERICAN SUPERCONDUCTOR CORP (US)
International Classes:
B22F7/00; B22F7/02; B23K35/36; C30B5/00; C30B23/02; H01B12/06; H01B13/00; H01L39/14; H01L39/24; (IPC1-7): H01L39/00
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