METHOD AND APPARATUS FOR FORMING PATTERN

WIPO Patent Application WO/1993/006618

A1

A method and apparatus for forming patterns, which are applicable favorably to manufacturing semiconductor integrated circuits, etc., by a projective exposure method. In the method, a pattern provided on a first substrate (3) is projected on the surface of a second substrate (7) via a projective optical system (6). In this case, such a phase difference pattern (5) as to give a predetermined phase difference to a transmitted light is provided beforehand on the sample plane as the pattern on the first substrate (3). The phase difference pattern (5) is projected, via the projective optical system (6), on a sensing plane (24), which is provided in the same plane as the surface of the second substrate (7). Then, the projective image of the phase difference pattern (5) is sensed using an optical sensor (12), and according to the sensed signal, the relative positional relation between the imaging plane formed by the projective optical system (6) and the sensing plane (24) is obtained. Then, according to the relative positional relation, the position of the second substrate is so controlled that the position of the sensing plane coincides with the position of the imaging plane.

TERASAWA TSUNEO (JP)
HAMA KATSUNOBU (JP)
KATAGIRI SOUICHI (JP)

PCT/JP1992/001200

April 01, 1993

September 21, 1992

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HITACHI LTD (JP)

G03F9/00; H01L21/68; (IPC1-7): H01L21/027

JPH03262901A	1991-11-22
JPH02188907A	1990-07-25
JPH0360011A	1991-03-15

Usuda, Toshiyuki (Room 44 New Marunouchi Building, 5-1, Marunouchi 1-chom, Chiyoda-ku Tokyo 100, JP)

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