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Patent Searching and Data


Title:
METHOD AND APPARATUS FOR FORMING RESIN FILM
Document Type and Number:
WIPO Patent Application WO/2008/029615
Kind Code:
A1
Abstract:
[PROBLEMS] To form a resin film having a uniform thickness and excellent smoothness, to provide a substrate which does not warp and has excellent planarity, and to clarify whether the resin film at the boundary between light irradiation region and light non-irradiation region is hardened or not. [MEANS FOR SOLVING PROBLEMS] At the time of or after flatting a liquid substance applied on a substrate by rotation, light irradiation is shifted from the center of the substrate toward the outer circumference and the liquid substance is hardened to form a resin film. The light is annularly applied, and the inner diameter and the outer diameter of the annular light concentrically increase with the rotation center axis line with the lapse of the irradiation time, and the annular light shifts from the inner circumference toward the outer circumference on the substrate.

Inventors:
OZAWA, Naoto (18-1, Takada 1-Chome Toshima-ku Tokyo, 55, 1718555, JP)
小澤 直人 (〒55 東京都豊島区高田1丁目18番1号 Tokyo, 1718555, JP)
Application Number:
JP2007/066229
Publication Date:
March 13, 2008
Filing Date:
August 22, 2007
Export Citation:
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Assignee:
ORIGIN ELECTRIC COMPANY, LIMITED (18-1, Takada 1-Chome Toshima-ku Tokyo, 55, 1718555, JP)
オリジン電気株式会社 (〒55 東京都豊島区高田1丁目18番1号 Tokyo, 1718555, JP)
OZAWA, Naoto (18-1, Takada 1-Chome Toshima-ku Tokyo, 55, 1718555, JP)
International Classes:
G11B7/26; G11B7/26
Attorney, Agent or Firm:
IZUMI, Kazuto (RK Building 3rd Floor 2-59-1, Shimocho Omiya-k, Saitama-shi Saitama 44, 3300844, JP)
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