Title:
METHOD OF AND APPARATUS FOR FORMING THREE-DIMENSIONAL STRUCTURES
Document Type and Number:
WIPO Patent Application WO2003095707
Kind Code:
A3
Abstract:
Enhanced Electrochemical fabrication processes are provided that can form three-dimensional multi-layer structures using semiconductor based circuitry as a substrate. Electrically functional portions of the structure are formed from structural material (e.g. nickel) that adheres to contact pads of the circuit. Aluminum contact pads and silicon structures are protected from copper diffusion damage by application of appropriate barrier layers. In some embodiments, nickel is applied to the aluminum contact pads via solder bump formation techniques using electroless nickel plating. In other embodiments, selective electroless copper plating or direct metallization is used to plate sacrificial material directly onto dielectric passivation layers. In still other embodiments, structural material deposition locations are shielded, then sacrificial material is deposited, the shielding is removed, and then structural material is deposited. In still other embodiments structural material is made to attach to non-contact pad regions.
Inventors:
COHEN ADAM L
ZHANG GANG
ZHANG GANG
Application Number:
PCT/US2003/014661
Publication Date:
August 18, 2005
Filing Date:
May 07, 2003
Export Citation:
Assignee:
MEMGEN CORP (US)
International Classes:
B81B3/00; G01P15/08; G01P15/125; H01P1/202; H01P3/06; H01P5/18; H01P11/00; H05K3/46; (IPC1-7): C25D1/00
Domestic Patent References:
| WO2000042231A2 | 2000-07-20 |
Foreign References:
| US6027630A | 2000-02-22 | |||
| US5685491A | 1997-11-11 | |||
| EP1179614A2 | 2002-02-13 |
Other References:
COHEN A ET AL: "EFAB: rapid, low-cost desktop micromachining of high aspect ratio true 3-D MEMS", MICRO ELECTRO MECHANICAL SYSTEMS, 1999. MEMS '99. TWELFTH IEEE INTERNATIONAL CONFERENCE ON ORLANDO, FL, USA 17-21 JAN. 1999, PISCATAWAY, NJ, USA,IEEE, US, 17 January 1999 (1999-01-17), pages 244 - 251, XP010321754, ISBN: 0-7803-5194-0
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