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Title:
METHOD AND APPARATUS FOR INSPECTING SUPERCONDUCTING WIRE ROD, AND METHOD FOR MANUFACTURING SUPERCONDUCTING WIRE ROD
Document Type and Number:
WIPO Patent Application WO/2016/027522
Kind Code:
A1
Abstract:
This method for inspecting a superconducting wire rod having a superconducting material layer formed on a substrate is provided with: a step (S210) for applying a magnetic field to the surface of the superconducting wire rod having been cooled to be in a superconducting state, said magnetic field being applied in the direction intersecting the superconducting wire rod surface, and generating peeling stress between the substrate and the superconducting material layer by means of interactions between the magnetic field and a shield current flowing in the superconducting material layer; a step (S220) for measuring superconducting characteristics of the superconducting wire rod after the peeling stress is applied; and a step (S230) for detecting, on the basis of results of the measurement of the superconducting characteristics of the superconducting wire rod, a failure area where the superconducting characteristics are deteriorated in the superconducting material layer.

Inventors:
SATO, Kenichi (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
NAGAISHI, Tatsuoki (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
Application Number:
JP2015/063069
Publication Date:
February 25, 2016
Filing Date:
May 01, 2015
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES, LTD. (5-33, Kitahama 4-chome Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
International Classes:
G01N27/72; G01N27/00; H01B13/00; H01F6/06
Foreign References:
JP2011133284A2011-07-07
JP2007078500A2007-03-29
Other References:
D. X. MA ET AL.: "Degradation of REBCO conductors caused by the screening current", SUPERCONDUCTOR SCIENCE AND TECHNOLOGY, vol. 26, no. 10, October 2013 (2013-10-01), pages 1 - 6
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (Nakanoshima Central Tower, 2-7 Nakanoshima 2-chome, Kita-ku, Osaka-sh, Osaka 05, 〒5300005, JP)
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