Title:
METHOD AND APPARATUS FOR MANUFACTURING CAMERA MODULE
Document Type and Number:
WIPO Patent Application WO/2014/171099
Kind Code:
A1
Abstract:
In this method and apparatus for manufacturing a camera module, relative positions of an array lens and an image pickup surface are adjusted, said relative positions being in the direction around a Z-axis parallel to an optical axis, then, relative positions of the array lens and the image pickup surface, said relative positions being in the Z-axis direction, the X-axis direction, and the Y-axis direction, respectively, are adjusted, and a tilt of the image pickup surface with respect to a plane perpendicular to the Z-axis is adjusted. Consequently, the number of times the positional adjustments of the image pickup surface of an image pickup element with respect to the array lens are performed is reduced, and the adjustments are performed in a short time.
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Inventors:
TAKENAKA KENICHI (JP)
Application Number:
PCT/JP2014/001964
Publication Date:
October 23, 2014
Filing Date:
April 04, 2014
Export Citation:
Assignee:
KONICA MINOLTA INC (JP)
International Classes:
H04N5/232; G02B7/02; H04N5/225
Foreign References:
| JP2005086659A | 2005-03-31 | |||
| JP2009141791A | 2009-06-25 |
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (JP)
Etsuji Kotani (JP)
Etsuji Kotani (JP)
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