Title:
METHOD AND APPARATUS FOR MANUFACTURING CONDUCTIVE FILM, AND CONDUCTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2010/134272
Kind Code:
A1
Abstract:
A method for manufacturing a conductive film is provided with: a step of having a material (2), which contains a fibrous conductive substance (2a) and has fluidity, between a substrate (3) and a mold (1) having a predetermined protruding/recessed shape (1a) on the surface; a step of reducing the fluidity of the material (2); and a step of peeling the mold (1) from the material (2).
Inventors:
NUKUI, Tohru (Akasaka Biz Tower 3-1, Akasaka 5-chome, Minato-k, Tokyo 25, 〒1076325, JP)
Application Number:
JP2010/003104
Publication Date:
November 25, 2010
Filing Date:
May 06, 2010
Export Citation:
Assignee:
TOKYO ELECTRON LIMITED (3-1 Akasaka 5-chome, Minato-ku Tokyo, 25, 〒1076325, JP)
東京エレクトロン株式会社 (〒25 東京都港区赤坂五丁目３番１号 Tokyo, 〒1076325, JP)
東京エレクトロン株式会社 (〒25 東京都港区赤坂五丁目３番１号 Tokyo, 〒1076325, JP)
International Classes:
H01B13/00; H01B5/14
Attorney, Agent or Firm:
SAKURA PATENT OFFICE, p.c. (Kanda Higashiyama Bldg, 1 Kandata-cho 2-chome, Chiyoda-k, Tokyo 46, 〒1010046, JP)
Claims:
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