METHOD AND APPARATUS FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT

Title:

METHOD AND APPARATUS FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT

Document Type and Number:

WIPO Patent Application WO/2018/070093

Kind Code:

A1

Abstract:

Disclosed is a method for manufacturing an electronic component 1A by forming an electrode 4A on an end section 2 of at least one electronic component main body 1, said end section 2 including an end surface 2A and a side surface 2B continuous from the end surface 2A. The method has: a first step for forming a conductive paste layer 4 on the end section 2; a second step for adjusting, before the conductive paste layer 4 hardens, the film thickness of the conductive paste layer 4 formed on the end surface 2A; and a third step for adjusting, before the conductive paste layer 4 hardens, the film thickness of the conductive paste layer 4 formed on the side surface 2B.

Inventors:

SATO EIJI (JP)
SAKAMOTO HITOSHI (JP)
MIYAZAWA MAKOTO (JP)
ISHIBASHI KENICHI (JP)

Application Number:

PCT/JP2017/028038

Publication Date:

April 19, 2018

Filing Date:

August 02, 2017

Export Citation:

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Assignee:

CREAISON CO LTD (JP)

International Classes:

H01G13/00; H01C17/28; H01F27/29; H01F41/10; H01G4/12; H01G4/30

Foreign References:

JP2011166030A	2011-08-25
JPH1022170A	1998-01-23
JP2007266485A	2007-10-11
JPH0869950A	1996-03-12

Attorney, Agent or Firm:

INOUE Hajime et al. (JP)

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