METHOD AND APPARATUS FOR MONITORING MEASUREMENT ACCURACY OF SEMICONDUCTOR, DEVICE, AND MEDIUM

WIPO Patent Application WO/2024/000632

A1

The present disclosure relates to a method and apparatus for monitoring the measurement accuracy of a semiconductor, a device, and a medium. The method comprises: obtaining real-time measurement data and scanned image measurement data of a self-alignment measurement reference pattern on a semiconductor structure; calculating first accuracy data by means of a first preset algorithm according to the real-time measurement data, calculating second accuracy data by means of the first preset algorithm according to the scanned image measurement data, and calculating target accuracy according to the first accuracy data and the second accuracy data; calculating a wafer difference by means of a second preset algorithm according to the real-time measurement data; and calculating target monitoring data by means of a third preset algorithm according to the target accuracy and the wafer difference, comparing the target monitoring data with preset accuracy range data, and determining, according to the comparison result, whether the overlay accuracy of a wafer is normal. According to the present disclosure, whether an overlay error obtained after etching meets a predetermined requirement can at least be automatically monitored, thereby effectively improving the measurement efficiency and accuracy of the semiconductor structure.

LIU RAN (CN)
ZHANG JUNJUN (CN)
ZHANG WEI (CN)

PCT/CN2022/104868

January 04, 2024

July 11, 2022

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CHANGXIN MEMORY TECH INC (CN)

G03F9/00

CN114675513A	2022-06-28
CN110865518A	2020-03-06
CN108089412A	2018-05-29
US10079185B1	2018-09-18
EP3171396A1	2017-05-24

ADVANCE CHINA IP LAW OFFICE (CN)

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