Title:
METHOD AND APPARATUS FOR NON-DESTRUCTIVE TESTING OF LEADED PACKAGES
Document Type and Number:
WIPO Patent Application WO2002103852
Kind Code:
A3
Abstract:
A method of non-destructively testing the adhesion of electrical leads joined to a package comprising the steps of holding the package and a portion of a lead in respective stationary positions, applying a force to the lead proximate an area where it's joined to the package, and measuring that resistance of the lead to the force. An apparatus for holding the package and leads during such testing comprising first and second holding members, each having three arms connected by a transverse member.
Inventors:
SZWEC RICHARD (US)
DONOHO EDWARD (US)
DONOHO EDWARD (US)
Application Number:
PCT/US2002/016575
Publication Date:
July 24, 2003
Filing Date:
June 17, 2002
Export Citation:
Assignee:
ITT MFG ENTERPRISES INC (US)
SZWEC RICHARD (US)
DONOHO EDWARD (US)
SZWEC RICHARD (US)
DONOHO EDWARD (US)
International Classes:
G01R1/04; H01L23/50; H01L23/04; (IPC1-7): H05K7/10; G01R1/04
Foreign References:
| US6057700A | 2000-05-02 |
Other References:
PATENT ABSTRACTS OF JAPAN vol. 016, no. 457 22 September 1992 (1992-09-22)
PATENT ABSTRACTS OF JAPAN vol. 009, no. 163 7 September 1985 (1985-09-07)
PATENT ABSTRACTS OF JAPAN vol. 009, no. 163 7 September 1985 (1985-09-07)
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