Title:
METHOD AND APPARATUS FOR OPTIMIZATION ANALYSIS OF BONDING POSITIONS ON STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2014/073018
Kind Code:
A1
Abstract:
The method for optimization analysis of bonding positions according to the present invention is a method for optimization analysis of point bonding or continuous bonding used when bonding a plurality of components configuring a structure model comprising planar elements or three dimensional elements, said method comprising: an analysis portion setting step for setting the portion to be analyzed for bonding points or bonding areas where the plurality of components are to be bonded; a fixed bond setting step for setting at least one bonding point or bonding area in the set portion to be analyzed as a fixed bonding point or fixed bonding area; a bonding candidate setting step for setting bonding candidates for bonding points or bonding areas in the portion to be analyzed; an analysis condition setting step for setting analysis conditions for the portion to be analyzed; and an analysis step for determining from among the bonding candidates an optimal bonding point or bonding area that satisfies the analysis condition.
Inventors:
SAITO TAKANOBU (JP)
Application Number:
PCT/JP2012/007101
Publication Date:
May 15, 2014
Filing Date:
November 06, 2012
Export Citation:
Assignee:
JFE STEEL CORP (JP)
International Classes:
B23K11/00; G06F17/50; B23K11/10; B23K31/00
Foreign References:
| JP2011221644A | 2011-11-04 | |||
| JP2011121086A | 2011-06-23 | |||
| JP2010250818A | 2010-11-04 |
Other References:
See also references of EP 2919139A4
Attorney, Agent or Firm:
KUMASAKA, Akira et al. (JP)
Akira Kumasaka (JP)
Akira Kumasaka (JP)
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