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Patent Searching and Data


Title:
METHOD AND APPARATUS FOR PLACING SOLDER BALLS ON A SUBSTRATE
Document Type and Number:
WIPO Patent Application WO2000020154
Kind Code:
A9
Abstract:
An apparatus for placing spheres at predetermined positions on a substrate. The apparatus includes a platform (112) to support the substrate at a first sphere placement position in the apparatus, and a placement station (107) disposed above the platform (112) that places spheres at locations on the substrate. The placement station (107) includes a first container (190) having a chamber to contain spheres, and a first carrier tray (182) having a substantially horizontal upper surface that forms a lower surface of the chamber. The upper surface has a first section and a second section, the second section having a plurality of holes (209) formed therein to receive spheres. The first carrier tray (182) is movable to position the second section between a fill position beneath the first container (190) and a place position disposed over the first sphere placement position. The placement station is constructed and arranged to fill the plurality of holes (209) with spheres when the second section is in the fill position, and place the spheres at the predetermined positions on the substrate when the second section is in the place position.

Inventors:
FREEMAN GARY
NOWAK THOMAS JR
PURCELL THOMAS
MIRABITO A JASON
SULLIVAN THOMAS M
Application Number:
US9923096W
Publication Date:
June 02, 2000
Filing Date:
October 05, 1999
Export Citation:
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Assignee:
SPEEDLINE TECHNOLOGIES, INC.
International Classes:
B23K1/00; B23K3/00; B23K3/06; H01L21/48; H01L21/60; H01L23/12; H05K3/34; B23K101/40; (IPC1-7): B23K3/06
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