METHOD AND APPARATUS FOR PLACING SOLDER BALLS ON A SUBSTRATE

WIPO Patent Application WO2000020154

A9

An apparatus for placing spheres at predetermined positions on a substrate. The apparatus includes a platform (112) to support the substrate at a first sphere placement position in the apparatus, and a placement station (107) disposed above the platform (112) that places spheres at locations on the substrate. The placement station (107) includes a first container (190) having a chamber to contain spheres, and a first carrier tray (182) having a substantially horizontal upper surface that forms a lower surface of the chamber. The upper surface has a first section and a second section, the second section having a plurality of holes (209) formed therein to receive spheres. The first carrier tray (182) is movable to position the second section between a fill position beneath the first container (190) and a place position disposed over the first sphere placement position. The placement station is constructed and arranged to fill the plurality of holes (209) with spheres when the second section is in the fill position, and place the spheres at the predetermined positions on the substrate when the second section is in the place position.

JPS61296952	BRAZING DEVICE
JPH08243732	SOLDERING DEVICE

FREEMAN GARY
NOWAK THOMAS JR
PURCELL THOMAS
MIRABITO A JASON
SULLIVAN THOMAS M

PCT/US1999/023096

June 02, 2000

October 05, 1999

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SPEEDLINE TECHNOLOGIES INC (US)

B23K3/00; B23K1/00; B23K3/06; H01L21/48; H01L21/60; H01L23/12; H05K3/34; B23K101/40; (IPC1-7): B23K3/06

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