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Title:
METHOD AND APPARATUS FOR PLATING TERMINAL MEMBER, AND TERMINAL MEMBER
Document Type and Number:
WIPO Patent Application WO/2015/060298
Kind Code:
A1
Abstract:
A method for plating a terminal member, which comprises adhering the terminal member to a jig and then supplying a plating solution to a terminal that is located at the tip of the terminal member through an opening formed on the jig to form a plate on the terminal, wherein a side wall member made from an insulating material is provided around the opening along the side surface of the terminal and the plate is formed on the tip of the terminal. A plating apparatus, in which an opening through which a plating solution is to be supplied is formed in a jig, and a side wall member made from an insulating material is provided around the opening along the side surface of a terminal. The adhesion of the plate onto the side surface of the terminal can be prevented by providing the side wall member.

Inventors:
OKUNO KENTARO (JP)
ARAI KENTARO (JP)
TSUTSUMI HIDETO (JP)
MIYAZAWA HIROSHI (JP)
Application Number:
PCT/JP2014/077936
Publication Date:
April 30, 2015
Filing Date:
October 21, 2014
Export Citation:
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Assignee:
DOWA METALTECH CO LTD (JP)
International Classes:
C25D5/02; C25D7/00; H01R13/04; H01R43/16
Foreign References:
JP2000038695A2000-02-08
JPH0297692A1990-04-10
JP2011108818A2011-06-02
JP2003003294A2003-01-08
JPS60190593A1985-09-28
JPS63105989A1988-05-11
Attorney, Agent or Firm:
HAGIWARA, Yasushi et al. (JP)
Yasushi Hagiwara (JP)
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