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Title:
METHOD AND APPARATUS FOR PRODUCING METAL BOND GRINDING WHEEL
Document Type and Number:
WIPO Patent Application WO/2010/137623
Kind Code:
A1
Abstract:
Disclosed is a method for producing a metal bond grinding wheel, wherein the power consumption is suppressed. In the method for producing a metal bond grinding wheel, a sintered metal bond grinding wheel is obtained by a sintering step in which a metal bond grinding wheel material obtained by mixing a metal binder powder and abrasive grains is sintered. In the sintering step, the sintered metal bond grinding wheel is obtained by heating the metal bond grinding wheel material containing the metal binder powder with microwaves. The sintering step may be a pressurized sintering step in which the metal bond grinding wheel material is heated with microwaves under a pressure.

Inventors:
YAMAZOE, Hiroshi (C/O NISSIN MANUFACTURING CO, LTD.22 Chitose, Mineyama-cho, Kyotango-sh, Kyoto 37, 〒6270037, JP)
山副 博 (〒37 京都府京丹後市峰山町千歳22番地 株式会社日進製作所内 Kyoto, 〒6270037, JP)
ITOI, Masahiro (C/O NISSIN MANUFACTURING CO, LTD.22 Chitose, Mineyama-cho, Kyotango-sh, Kyoto 37, 〒6270037, JP)
糸井 正拡 (〒37 京都府京丹後市峰山町千歳22番地 株式会社日進製作所内 Kyoto, 〒6270037, JP)
Application Number:
JP2010/058922
Publication Date:
December 02, 2010
Filing Date:
May 26, 2010
Export Citation:
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Assignee:
NISSIN MANUFACTURING CO., LTD. (22 Chitose, Mineyama-cho Kyotango-sh, Kyoto 37, 〒6270037, JP)
株式会社日進製作所 (〒37 京都府京丹後市峰山町千歳22番地 Kyoto, 〒6270037, JP)
Kyoto University (36-1, Yoshida-honmachi Sakyo-ku, Kyoto-sh, Kyoto 01, 〒6068501, JP)
国立大学法人京都大学 (〒01 京都府京都市左京区吉田本町36番地1 Kyoto, 〒6068501, JP)
YAMAZOE, Hiroshi (C/O NISSIN MANUFACTURING CO, LTD.22 Chitose, Mineyama-cho, Kyotango-sh, Kyoto 37, 〒6270037, JP)
山副 博 (〒37 京都府京丹後市峰山町千歳22番地 株式会社日進製作所内 Kyoto, 〒6270037, JP)
International Classes:
B24D3/00; B24D3/06
Foreign References:
JP2002530212A2002-09-17
JPS6458478A1989-03-06
JPH0492870A1992-03-25
JPH03267304A1991-11-28
Attorney, Agent or Firm:
SunCrest Patent and Trademark Attorneys (1-11, Sakaemachidori 4-chome Chuo-ku,,Kobe-sh, Hyogo 23, 〒6500023, JP)
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