METHOD AND APPARATUS FOR PRODUCING NON-PLANAR FORMED PARTS USING COMPACTION MOLDING COMPOUNDS, AND PARTS FORMED USING SAME

Title:

METHOD AND APPARATUS FOR PRODUCING NON-PLANAR FORMED PARTS USING COMPACTION MOLDING COMPOUNDS, AND PARTS FORMED USING SAME

Document Type and Number:

WIPO Patent Application WO2003106131

Kind Code:

A3

Abstract:

Molding apparatus (100) for producing non-planar parts using compaction molding compounds (CMC) comprises a mold (1-10) having a cavity which receives CMC therein, the mold including a movable platen assembly having at least two plates (7, 8) movable in substantially parallel directions to compact CMC placed in the cavity, and an actuating mechanism (9, 10, 13) which moves the plates simultaneously at different respective velocities such that the CMC is substantially uniformly compacted into a nonplanar shape with a predetermined, substantially uniform density.

Inventors:

SOH SUNG KUK (US)

Application Number:

PCT/US2003/018903

Publication Date:

April 29, 2004

Filing Date:

June 17, 2003

Export Citation:

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Assignee:

SOH SUNG KUK (US)

International Classes:

B27N3/08; B27N5/00; B29C43/00; B29C43/58; (IPC1-7): B29C43/04

Foreign References:

US3166617A	1965-01-19
US4853180A	1989-08-01
US4373889A	1983-02-15
US5100601A	1992-03-31

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