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Title:
METHOD AND APPARATUS FOR PRODUCING A STAMPED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO1988003356
Kind Code:
A3
Abstract:
Method and apparatus (10) for forming power distribution systems or parts thereof during punching operations. A planar member (16) of conductive material is located proximate to a substrate (14) upon which the power distribution system or part thereof is to be formed. A punch (18) is used to form the conductors (12) from the planar member (16) and deposit the conductors (12) on the substrate (14). The action of the punch (18) causes mechanical interference between the conductor (12) and the substrate (14) thereby securing the conductor to the substrate. The power distribution system or part thereof may comprise a terminal assembly, an electric switch, a heat sink of an electronic module, or an electrical circuit board.

Inventors:
WHEELER DALE K (US)
Application Number:
PCT/US1987/002300
Publication Date:
June 02, 1988
Filing Date:
September 09, 1987
Export Citation:
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Assignee:
BLACK & DECKER INC (US)
International Classes:
B29C65/56; B29C65/60; B29C65/64; B29C69/00; B32B43/00; H01H11/06; B21D39/03; H01R9/16; H01R12/04; H01R43/20; H05K3/04; H05K3/20; H05K3/40; H05K3/46; H05K7/06; H05K7/20; H05K1/00; H05K3/30; (IPC1-7): H05K3/04; B29C65/60; B29C65/64; B29C69/00; H05K3/46; H01R9/16
Foreign References:
FR687094A1930-08-04
US2938939A1960-05-31
BE723315A1969-04-16
GB989471A1965-04-22
GB2072059A1981-09-30
CH361553A1962-04-30
GB661989A1951-11-28
US3464051A1969-08-26
DE1920061U1965-07-22
FR2291600A11976-06-11
US3945808A1976-03-23
DE2934869A11981-03-19
Other References:
See also references of EP 0326571A1
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