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Title:
METHOD AND APPARATUS FOR REMOVING MOISTURE FROM MOISTURE-DEPOSITED COMPONENT
Document Type and Number:
WIPO Patent Application WO/2017/090215
Kind Code:
A1
Abstract:
[Problem] To reduce costs and environmental load by keeping the amount of use of heat medium liquid to the minimum necessary, and to enable removal of not only moisture deposited on a moisture-deposited component but also the heat medium liquid in a single operation. [Solution] A moisture-deposited component 15 on which moisture is deposited is disposed in a steam atmosphere of a heat medium liquid 8 the boiling point of which is 100 ºC or more to cause steam 11 of the heat medium liquid 8 to condense on the surface of the moisture-deposited component 15, and the moisture deposited on the moisture-deposited component 15 is allowed to flow down together with the condensed heat medium liquid 8. After the moisture-deposited component 15 has been kept in the steam atmosphere until the moisture deposited on the moisture-deposited component 15 is evaporated due to the temperature of the steam of the heat medium liquid 8, by stopping the supply of the steam of the heat medium liquid 8 to the moisture-deposited component 15 or by disposing the moisture-deposited component 15 outside the steam atmosphere, the moisture and the heat medium liquid 8 deposited on the moisture-deposited component 15 are evaporated to allow the moisture-deposited component 15 to dry by its own heat.

Inventors:
UCHINO MASAHIDE (JP)
Application Number:
PCT/JP2016/002106
Publication Date:
June 01, 2017
Filing Date:
April 20, 2016
Export Citation:
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Assignee:
JAPAN FIELD KK (JP)
International Classes:
F26B3/04; B08B3/02; B08B3/08; F26B21/14
Foreign References:
JPS4821545B11973-06-29
JP2007216144A2007-08-30
JPH0669184A1994-03-11
JPH04280632A1992-10-06
JP2010162537A2010-07-29
JPH0921586A1997-01-21
JP2012163220A2012-08-30
JPH0118482A
JP2010279866A2010-12-16
JP2010169281A2010-08-05
JP2011047570A2011-03-10
JPH1140536A1999-02-12
JPS53141973A1978-12-11
Attorney, Agent or Firm:
GINZA SOGO PATENT FIRM (JP)
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