METHOD AND APPARATUS FOR SEPARATING SOLDER

WIPO Patent Application WO/1998/024939

A1

A method and an apparatus for separating and recovering solder from a device or component, such as a printed board mounted with electronic parts. A heat medium made of solid particles or a liquid is used. This heat medium is brought into contact with a device or component so as to melt the solder with the heat transmitted from the heat medium thereto and apply an impact force to a soldered portion by means of the heat medium. A portion soldered has a high wettability with solder, and the solder cannot be separated therefrom by merely melting the same. However, the method enables the solder to be separated at a separation rate of as high as over 95 %.

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SATOU KAZUHIKO (JP)
SATOU KOUJI (JP)
YASUDA TAKESHI (JP)
YAMADA RYOKICHI (JP)
ARATO TOSHIAKI (JP)
KANEKO TOMOKO (JP)
YAMASHITA HISAO (JP)
AZUHATA SHIGERU (JP)
HASEGAWA TSUTOMU (JP)

PCT/JP1996/003585

June 11, 1998

December 06, 1996

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HITACHI LTD (JP)
SATO KAZUHIKO (JP)
SATO KOUJI (JP)
YASUDA TAKESHI (JP)
YAMADA RYOKICHI (JP)
ARATO TOSHIAKI (JP)
KANEKO TOMOKO (JP)
YAMASHITA HISAO (JP)
AZUHATA SHIGERU (JP)
HASEGAWA TSUTOMU (JP)

C22B7/00; C22B25/06; (IPC1-7): C22B7/00

JPH0734150A	1995-02-03
JPH0873955A	1996-03-19

Ogawa, Katsuo (5-1, Marunouchi 1-chom, Chiyoda-ku Tokyo 100, JP)

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