METHOD AND APPARATUS FOR SOLDERING ELECTRONIC COMPONENT

Title:

METHOD AND APPARATUS FOR SOLDERING ELECTRONIC COMPONENT

Document Type and Number:

WIPO Patent Application WO/1988/005250

Kind Code:

A1

Abstract:

Soldering method wherein a high-energy beam such as a laser beam is projected onto different lead terminal arrays of electronic components, the beam being projected in a scanning manner a plurality of times two-dimensionally and continuously. The invention further relates to a soldering apparatus comprising a mechanism for holding an electronic component by the tip thereof, a rotary drive mechanism (27) which turns said electronic component holding mechanism so that the position of the electronic component in the rotational direction is brought into agreement with a practical mounting position on the circuit board, holding unit-drive mechanisms (21, 22, 25) that move the electronic component-holding mechanism three-dimensionally, beam radiation mechanisms (41, 42) for irradiating the surface of the circuit board with high energy, beam radiation angle change mechanisms (53, 54) for changing the radiation angle of the high-energy beam emitted from the beam radiation mechanisms relative to the circuit board, and a beam scanning controller (47) which controls the beam radiation angle change mechanisms such that the high-energy beam scans a predetermined lead terminal array of the electronic components mounted on the circuit board a predetermined number of times. Using this apparatus, the soldering is effected under the conditions where the temperature rise near the lead terminals and the temperature distribution are uniformalized.

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Inventors:

CHIBA KOICHI (JP)

Application Number:

PCT/JP1987/001049

Publication Date:

July 14, 1988

Filing Date:

December 28, 1987

Export Citation:

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Assignee:

TOSHIBA KK (JP)

International Classes:

B23K1/005; B23K26/10; H05K3/34; H05K13/04; (IPC1-7): H05K3/34; B23K3/04

Foreign References:

JPS5992163A	1984-05-28
JPS61208893A	1986-09-17
JPS62144875A	1987-06-29

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