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Patent Searching and Data


Title:
METHOD AND APPARATUS FOR TESTING PRINTED CIRCUIT BOARD (PCB)
Document Type and Number:
WIPO Patent Application WO/2021/000842
Kind Code:
A1
Abstract:
A method for processing a printed circuit board (PCB), comprising: determining the position of a region to be tested (22, 41) on a PCB (S102); removing a designated layer (31; 51, 52) at the position, so as to expose a surface of an insulation layer (34, 55) to generate said region (22, 41) (S104); using an auxiliary image identifier (231, 232, 233; 421, 422) arranged around said region (22, 41) to make an adjustment and place a strain gauge on said region (22, 41) for adhesion (S106); and connecting a testing device to the strain gauge and testing said region (S108). Also disclosed is an apparatus for processing a printed circuit board (PCB). The present invention solves the problem of high costs caused by the fact that a PCB will be scrapped after testing in a traditional testing method, and achieves the effect of reducing PCB testing costs.

Inventors:
XIAO SHOUCHUN (CN)
Application Number:
PCT/CN2020/099015
Publication Date:
January 07, 2021
Filing Date:
June 29, 2020
Export Citation:
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Assignee:
ZTE CORP (CN)
International Classes:
H05K3/00; G01B21/32; G01L1/22
Foreign References:
CN107835559A2018-03-23
CN107484359A2017-12-15
CN103728066A2014-04-16
CN109511232A2019-03-22
CN106643636A2017-05-10
CN103528493A2014-01-22
CN101460818A2009-06-17
CN109540355A2019-03-29
CN201266074Y2009-07-01
CN105675413A2016-06-15
CN101965506A2011-02-02
CN107509303A2017-12-22
CN108760124A2018-11-06
GB2414116B2007-03-14
Attorney, Agent or Firm:
KANGXIN PARTNERS, P.C. (CN)
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