Title:
METHOD FOR APPLYING AN ELECTRONIC ASSEMBLY TO A SUBSTRATE AND A DEVICE FOR APPLYING SAID ASSEMBLY
Document Type and Number:
WIPO Patent Application WO2006082199
Kind Code:
A3
Abstract:
The aim of said invention is to ensure a maximum accuracy for producing an electronic assembly based on a small-sized chip and for applying said assembly to an insulating substrate. Said aim is attained by a method for applying at least one electronic assembly consisting of a chip (4), which is provided with at least one electric contact (5, 5') arranged on the surface thereof, to a support called a substrate (7), wherein said contact is connected to a segment (3,3') of a strip conductor and said application is carried out by means of an application device (6) which holds and positions said substrate (7). The inventive method consists in forming the segment (3,3') of the strip conductor having a predetermined contour, in transferring said strip segment (3,3') to the application device (6), in grasping the chip (4) by means of the application device (6) for transporting the strip segment (3,3') in such a way that said strip segment (3,3') is applied to at least one contact (5, 5') of the chip (4), in placing the electronic assembly consisting of the chip (4) and the strip segment (3, 3') on the substrate (7) in a predetermined position an in inserting said chip (4) and the strip segment (3, 3') into substrate (7). The application device used for carrying out said method and a portable object comprising the electronic assembly applied according to the inventive method are also disclosed.
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Inventors:
DROZ FRANCOIS (CH)
Application Number:
PCT/EP2006/050585
Publication Date:
November 23, 2006
Filing Date:
February 01, 2006
Export Citation:
Assignee:
NAGRAID SA (CH)
DROZ FRANCOIS (CH)
DROZ FRANCOIS (CH)
International Classes:
G06K19/077
Foreign References:
| FR2780534A1 | 1999-12-31 | |||
| EP0694871A1 | 1996-01-31 | |||
| US20040194876A1 | 2004-10-07 |
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