Title:
METHOD FOR APPLYING ELECTRONIC COMPONENT BONDING MATERIAL AND CIRCUIT BOARD ON WHICH ELECTRONIC COMPONENT IS MOUNTED
Document Type and Number:
WIPO Patent Application WO/2020/121971
Kind Code:
A1
Abstract:
Provided is an application method for line drawing application of a conductive adhesive 21 on a circuit board to mount a surface mounting electronic component 30 that has a plurality of terminals on the circuit board which has lands 10 to which the terminals are electrically connected, the method comprising applying the conductive adhesive 21 on the lands 10 in areas narrower than widths thereof and causing a center-to-center spacing between application end points of adjacent lands 10 to be larger than the sum of the distance between the lands 10 and the width of the lands 10.
Inventors:
OKA TAKAMITSU
NOZAKI KOJI
TAKANO TORU
NOZAKI KOJI
TAKANO TORU
Application Number:
PCT/JP2019/047858
Publication Date:
June 18, 2020
Filing Date:
December 06, 2019
Export Citation:
Assignee:
JOHNAN CORP (JP)
International Classes:
H05K3/32; H05K3/34
Foreign References:
| JPH105655A | 1998-01-13 |
Attorney, Agent or Firm:
ARC PATENT ATTORNEY'S OFFICE (JP)
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