received by the International Bureau on 21 April 2017 (21 -04-2017)

1. A multilayer structure (100), comprising a preferably flexible substrate film (102) having a first side and opposite second side, said substrate film being thermoformed to exhibit a desired shape, said substrate film further comprising, on the first side, element or material (113) nonadherent to plastic molded thereon, a number of conductive traces (108), optionally defining contact pads and/or conductors, preferably printed on the first side of the substrate film by printed electronics technology for establishing a desired predetermined circuit design, a plastic layer (104) molded onto the first side of the substrate film (102) so as to enclose the circuit between the plastic layer and the first side of the substrate film (102), and a connector (114) in a form of a preferably flexible flap for providing external electrical connection to the embedded circuit from the second, opposite side of the substrate film (102), the connector being defined by a portion of the substrate film accommodating at least part of one or more of the conductive traces (108) and cut partially loose from the surrounding substrate material so as to establish the flap, the loose end of which is bendable away from the molded plastic layer to facilitate the establishment of said electrical connection with an external element (118), such as a wire or connector, via the associated gap.

2. The structure of claim 1, wherein the location of the non-adherent element or material substantially corresponds to the location of the connector.

3. The structure of any preceding claim, comprising primer on the first side of the substrate film (102) to strengthen the attachment of the substrate film (102) to the molded plastic layer (104), the areas provided with primer substantially excluding the area of the connector flap (114).

4. The structure of any preceding claim, comprising a further film (1 10) on the side of the plastic layer (104) facing away from the substrate film (102), optionally accommodating graphics (111) and/ or electronics (112) thereon. 5. The structure of any preceding claim, comprising a fold at the interface region (1 16) of the connector flap (1 14) and the rest of the substrate film (102).

6. The structure of any preceding claim, wherein the fold incorporates a blind cut or perforation.

7. The structure of any preceding claim, comprising one or more embedded color or graphical layers preferably exhibiting a desired color, figure, graphical pattern, symbol, text, numeric, alphanumeric and/or other visual indication. 8. A method for manufacturing a multilayer structure (100), comprising obtaining a substrate film (404) for accommodating electronics, providing, preferably through printing, a number of conductive traces (406), and optionally electronic components (408), on a first side of the substrate film to establish a predetermined circuit design, preferably further thermoforming the substrate to exhibit a desired shape, molding the thermoplastic material (410) on said first side of the substrate film to substantially seal the circuit between the plastic layer and the first side of the substrate film, and cutting, from the substrate film, optionally excluding the periphery of the film, a partially loose flap portion (412) comprising conductive region facing the molded material and preferably accommodating at least part of one or more of the traces.

9. The method of claim 8, further comprising providing a separator material or element substantially non-adherent (408) to thermoplastic material to be molded on the first side of the substrate.

10. The method of claim 9, wherein the separator material is provided to a predefined location of a connector flap on the first side.

11. The method of any of claims 8-10, further comprising bending the loose connector flap portion away from the molded plastic layer and the level of the remaining substrate film to enable an external element, optionally a wire or a connector, to contact the conductive region of the flap from a second, opposite side of the substrate film via the established gap.