METHOD FOR ASSEMBLING HEAT ABSORPTION BLOCK AND HEAT PIPE AND THE ASSEMBLY OF THE SAME Technical Field The present invention relates to a method for assembling a heat absorption block and a plurality of heat pipes with each other and an assembly thereof, and more particularly, to a method for assembling a heat absorption block, which is used as a cooling device for rapidly radiating the heat generated from a central processing unit (hereinafter, referred to as CPU) mounted on a main board of a computer, and a plurality of heat pipes serving as ultra thermal conduction elements, and to an assembly of the heat absorption block and the heat pipes.

Background Art With the rapid development of an information-oriented society, generally, there is a need for installation of a computer for operating (processing) a large amount of information and data. To meet such demand of consumers, there has been provided a CPU that is able to process an enormous amount of data at a rapid speed.

The CPU generates a relatively large amount of heat, while processing the data, and if the heat is raised to a predetermined temperature, it will give an adverse effect in the operation of the system, which causes the malfunction of the system.

To prevent the malfunction of the system due to the overheat of the CPU, the heat produced from the CPU should be radiated and kept at an

appropriate temperature, that is, at a temperature in a range of 50 °C to 60 °C. If the temperature is more than 100 °C, the system may be operated unstably and even down. To make the CPU operate at a normal state, therefore, the heat should be forced to be radiated.

The heat produced from the CPU can be forced to be cool with a conventionally used cooling device 1 as shown in FIG. 1.

As shown, the cooling device 1 includes a heat sink body 2 and a cooling fan 3 fixed on the top portion side of the heat sink body 2 by fixing means such as a bolt. The heat sink body 2 is provided with a plurality of radiating plates that are formed as an integral body therewith, in the interior thereof. The cooling device 1 gets close into the top portion side of the CPU in such a manner as to be mounted on the CPU.

Under the above construction, the heat produced from the CPU is transmitted to the plurality of radiating plates through the plate of the heat sink body 2 so that the cooling fan 3 on the top portion side of the heat sink body 2 starts to operate.

When the cooling fan 3 operates, the heat that has been transmitted to the plurality of radiating plates of the heat sink body 2 gets cool by the application of the air flow from the plurality of radiating plates as the cooling fan 3 rotates, such that the heat produced from the CPU can become cool.

Since the heat from the CPU is transmitted to the heat sink body 2 that is made of a metal material, however, there is a relatively large temperature difference between the plate of the heat sink body 2 and the top

ends of the plurality of radiating plates. This causes the heat conductivity to be undesirably deteriorated, thereby making it difficult to radiate the heat in an effective way. As a result, the cooling efficiency becomes low, thereby making the operation of the system undesirably unstable.

To solve such the inconveniences as shown in FIG. 2, there is provided another conventional cooling device with a heat pipe for transmitting heat.

The structure of the heat pipe is well known in this field, and therefore, an explanation of it will be discussed briefly.

As shown, a heat absorption block 10 is provided with an insertion hole into which a heat pipe 20 is fixedly inserted, and the heat pipe 20 is provided with a radiator 30 on which a separate cooling fan (which is omitted in the drawing) is mounted, for radiating the heat caused from the CPU, on the front end thereof.

The cooling device comes close on the top portion side of the CPU and is then mounted thereon. The heat produced from the CPU is transmitted to the heat absorption block 10 and then to the heat pipe 20.

The operation fluid that exists in the heat absorption part of the heat pipe 20 is evaporated in such a manner as to move up to the radiating part where the radiator 30 is disposed. The operation fluid, which moves to the radiating part, serves to radiate the heat and at the same time, it is condensed to return to the heat absorption part of the heat pipe 20.

The heat produced from the CPU can be effectively radiated by the repetition of the operations as mentioned above.

Since, however, the conventional cooling device adapts a way of fixedly inserting the heat pipe 20 into the insertion hole of the heat absorption block 10 by the extension of the heat pipe 20 or in a tightly fitting manner, there occur some problems that it is difficult to carry out the insertion, it is hard to achieve an accurate fixing, and it is easy to generate the movement of the heat pipe 20 after fixed.

Moreover, in case of mounting the cooling device on a general desktop computer, a space where the cooling device is mounted is too narrow, thereby causing many difficulties during the mounting.

Disclosure of Invention It is an object of the present invention to provide a method for assembling a heat absorption block and a plurality of heat pipes in which the heat pipes are firmly fixed in a simple manner into the insertion holes of the heat absorption block having the corresponding number to the heat pipes.

It is another object of the present invention to provide an assembly of a heat absorption block and a plurality of heat pipes that makes use of the space of a desktop computer in an effective way, thereby enabling cooling efficiency to be maximized.

According to an aspect of the present invention, there is provided a method for assembling a heat absorption block and a plurality of heat pipes that comprises the steps of preparing the heat absorption block with the corresponding number of insertion holes to the heat pipes that are passed through the both ends thereof and with the corresponding number of beads

to the insertion holes arranged on the side adjacent to the insertion holes along the insertion holes; inserting the heat pipes into the insertion holes of the heat absorption block; and after insertion, pressurizing the beads in such a manner as to be transformed and at the same time pressing and fixing the heat pipes.

According to another aspect of the present invention, there is provided an assembly of a heat absorption block and a plurality of heat pipes that comprises: the heat absorption block with the corresponding number of insertion holes to the heat pipes passed through the both ends thereof and with the corresponding number of beads to the insertion holes arranged on the side adjacent to the insertion holes along the insertion holes; and the heat pipes adapted to be inserted into the insertion holes of the heat absorption block and to be pressed and fixed as the beads are pressurized and transformed.

Brief Description of the Drawings Further objects and advantages of the invention can be more fully understood from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. 1 is a perspective view illustrating a conventional cooling device; FIG. 2 is a perspective view illustrating another conventional cooling device; FIG. 3 is a flowchart illustrating a method of assembling a heat

absorption block and a plurality of heat pipes according to the present invention; FIG. 4 is a perspective view illustrating each step in FIG. 3; FIG. 5 is a perspective view illustrating the assembly of a heat absorption block and a plurality of heat pipes according to an embodiment of the present invention; FIG. 6 is a perspective view for the assembly of the present invention that is mounted onto a main board of a computer ; and FIG. 7 is a perspective view illustrating the assembly of a heat absorption block and a plurality of heat pipes according to another embodiment of the present invention.

Best mode for Carrying Out the Invention Now, an explanation of the preferred embodiments of the present invention will be described with reference to accompanying drawings.

FIG. 3 is a flowchart illustrating a method of assembling a heat absorption block and a plurality of heat pipes according to the present invention, and FIG. 4 is a perspective view illustrating each step in FIG. 3.

As shown, the method for assembling a heat absorption block 10 and a plurality of heat pipes 20 according to the present invention comprises the steps of : preparing the heat absorption block 10 with the corresponding number of insertion holes 11 to the heat pipes 20 passed through the both ends thereof and with the corresponding number of beads 12 to the insertion holes 11 arranged on the side adjacent to the insertion holes 11 along the insertion holes 11 (at step S1) ; inserting the heat pipes 20 into the insertion

holes 11 of the heat absorption block 10 (at step S2); and after insertion, pressurizing the beads 12 in such a manner as to be transformed and at the same time pressing and fixing the heat pipes 20 (at step S3).

In this case, the beads 12 of the heat absorption block 10 are desirably pressed by means of a press or a roller.

At the step S3 of pressing the beads 12 of the heat absorption block 10 to press and fix the heat pipes 20 is formed a pressed part 14.

With the method as mentioned above, the assembly of the heat absorption block 10 and the plurality of heat pipes 20 according to the present invention is constructed, as will be discussed hereinafter.

FIG. 5 is a perspective view illustrating the assembly of the heat absorption block and the plurality of heat pipes according to an embodiment of the present invention, and FIG. 6 is a perspective view for the assembly of the present invention that is mounted onto a main board of a computer.

As shown, the assembly 100 includes the heat absorption block 10, the heat pipes 20, and a radiator 30.

The heat absorption block 10 is provided with the plurality of insertion holes 11 that are passed through the both ends thereof, each of which is formed adjacent to the contact face with the CPU 5.

The heat absorption block 10 is also provided with a clip insertion groove 13 on the opposite side to the contact face into the CPU 5 into which a clip 60 is inserted such that the heat absorption block 10 is mounted on a main board 4.

The heat pipes 20 are inserted into the insertion holes 11 of the heat

absorption block 10 on the one ends thereof and then fixedly pressed by the pressure applied from the outside. The heat pipes 20 are bent on the one sides thereof so that the radiator 30 is disposed on the front ends of the heat pipes 20.

The pressure applied from the outside is obtained by means of a press or a roller.

The radiator 30 includes a plurality of cooling fins 31 that are spaced at equal intervals from each other on the front ends of the heat pipes 20 and a cooling fan guide 32 that contains the plurality of cooling fins 31.

On the top portion side of the cooling fan guide 32 of the radiator 30 is provided a cooling fan (which is not shown in the drawing).

FIG. 7 is a perspective view illustrating the assembly of the heat absorption block 10 and the plurality of heat pipes 20 according to another embodiment of the present invention. In this embodiment of the present invention, the assembling method is the same as the above assembly 100 and the radiator 30 is disposed on the front ends of the one sides of the heat pipes 20 fixed on the heat absorption block 10 so that it is placed on the horizontal line to the heat absorption block 10.

In the assembly 100 according to the present invention, the clip 60 is mounted onto the clip insertion groove 13 of the heat absorption block 10, and the assembly 100 is disposed close to the top portion side of the CPU 5 so that it is fixed by means of the clip 60 on the main board 4.

On the other hand, the heat produced from the CPU 5 is transmitted to the heat absorption block 10 and to the heat absorption part of the heat

pipes 20 fixed as an integral body with the heat absorption block 10. At that time, the operation fluid within the heat pipes 20 is evaporated such that it moves to the heat radiating part where the radiator 30 is disposed.

A current of air that is formed by the operation of the cooling fan (which is not shown) mounted on the top side of the radiator 30 is passed between each of the cooling fins 31 so that the cooling fins 31 become cool. At the same time, the operation fluid that has moved to the radiating part is condensed to return to the heat absorption part of the heat pipes 20.

The heat produced from the CPU 5 can be effectively radiated by the repetition of the operations as mentioned above.

Also, the assembly 100 has the radiator 30 which can be separated from the top side of the heat absorption block 10, such that the interior space of the desktop computer can be utilized effectively, and even if the radiator 30 is larger in size than the heat absorption block 10, it can be disposed while not giving any affect on the peripheral parts, thereby making the cooling efficiency greatly high.

In the assembling procedure of the heat absorption block 10 and the heat pipes 20, if the beads 12 that formed protrudedly on the surface adjacent to the insertion holes 11 are pressurized in the state where the heat pipes 20 are inserted into the insertion holes 11 of the heat absorption block 10, they are pressed and fixed with the flat surface having the same height as each other so that the one sides of the insertion holes 11 are pressed and transformed to correspond with the pressed amount of the beads 12 and at the same time the one sides of the heat pipes 20 are fixedly pressed into the

heat absorption block 10.

Industrial applicability As set forth in the foregoing, there is provided a method for assembling a heat absorption block and a plurality of heat pipes in which the heat pipes are firmly fixed into the insertion holes of the heat absorption block and the beads formed protrudedly on the surface adjacent on the insertion holes are pressurized so that the heat pipes can be firmly fixed into the heat absorption block.

Additionally, there is provided an assembly of a heat absorption block and a plurality of heat pipes, the heat pipes fixed in the heat absorption block and bent on the one side to dispose a radiator on the front ends, whereby it can make use of the space of a desktop computer in an effective way and design the radiator larger in size than the heat absorption block, thereby making the cooling efficiency greatly high.