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Title:
METHOD OF ASSEMBLING A SEMICONDUCTOR COMPONENT AND APPARATUS THEREFOR
Document Type and Number:
WIPO Patent Application WO2006019460
Kind Code:
A3
Abstract:
A method of assembling a semiconductor component includes providing a pedestal (61), placing a first piece (52) on the pedestal, wherein the first piece comprises a semiconductor die (54), placing a second piece (56, 58) over the first piece, and providing an adhesive (60) between the first piece and the second piece. The method further includes applying pressure with a first plate to the first piece and second piece to snap the first piece with the second piece, and applying heat with a second plate to reflow the adhesive, wherein applying heat is performed simultaneously with applying pressure.

More Like This:
WO/2001/056067MICRO ELECTRO-MECHANICAL COMPONENT AND SYSTEM ARCHITECTURE
JP3704113METHOD OF BONDING, BONDING STAGE, AND ELECTRONIC COMPONENT MOUNTER
Inventors:
SANCHEZ AUDEL A (US)
KIM TAEK K (US)
Application Number:
PCT/US2005/018863
Publication Date:
September 14, 2006
Filing Date:
May 27, 2005
Export Citation:
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Assignee:
FREESCALE SEMICONDUCTOR INC (US)
SANCHEZ AUDEL A (US)
KIM TAEK K (US)
International Classes:
H01L21/44; F28F7/00; H01L21/50; H01L23/10; H01L23/28; H01L23/495
Foreign References:
US6534839B12003-03-18
US6204090B12001-03-20
US5509464A1996-04-23
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