METHOD FOR ASSESSING SOLDER MOUNTING PERFORMANCE

WIPO Patent Application WO/2013/051650

A1

The present invention provides a method for evaluating mounting performance of a solder onto an electrode, by assessing wettability of the solder on the metal of an electrode formed on a semiconductor chip or substrate, through an inexpensive, simple, and rapid method. A method for assessing solder mounting performance when a flux is used, the method being characterized in comprising loading a plurality of solders atop a metal plate, performing a heat treatment at a temperature 10-50°C higher than the melting point of the solders without using a flux; and thereafter counting the number of solders bonded to the metal plate.

WO/1999/030129	METHOD FOR CHARACTERISING COMPLEX FLUIDS AND APPLIANCES RESULTING FROM SAID METHOD
JP2006038474	TESTING METHOD RELATED TO IMPREGNATION OR PENETRATION PROPERTIES OF ELECTRIC INSULATING RESIN COMPOSITION AND ITS TEST PIECE
WO/2010/049447	TWO-COMPARTMENT DISSOLUTION APPARATUS AND PROCESS

KOBAYASHI TAKAYUKI (JP)
ONOUE KOZO (JP)
SASAKI TSUTOMU (JP)
TANAKA MASAMOTO (JP)
KIMURA KATSUICHI (JP)
TERASHIMA SHINICHI (JP)

PCT/JP2012/075802

April 11, 2013

October 04, 2012

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NIPPON STEEL & SUMIKIN MAT CO (JP)
NIPPON MICROMETAL CORP (JP)

G01N13/00; B23K1/00; G01N19/04

JPH08159953A	1996-06-21
JPH114067A	1999-01-06
JP2005033149A	2005-02-03
JPH04353745A	1992-12-08

USHIKI, Mamoru (JP)
牛木 護 (JP)

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