Title:
METHOD OF ATTACHING A THIN DIE USING SACRIFICIAL MATERIAL TO INHIBIT DIE WARPAGE AND CORRESPONDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/119944
Kind Code:
A3
Abstract:
A layer of sacrificial material (330) applied to a thin die (320) prior to die attach provides stability to the thin die and inhibits warpage of the thin die as heat is applied to the die and substrate (302) during die attach. The sacrificial material may be a material that sublimates decomposes at a temperature near the reflow temperature of interconnects (304,322) on the thin die. A die attach process deposits the sacrificial material on the die, attaches the die to a substrate, and applies a first temperature to reflow the interconnects. At the first temperature, the sacrificial material maintains substantially the same thickness. A second temperature is applied to sublimate decompose the sacrificial material leaving a clean surface for the later packaging processes. Examples of the sacrificial material include polypropylene carbonate and polyethylene carbonate.
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Inventors:
BCHIR OMAR J (US)
Application Number:
PCT/US2011/029975
Publication Date:
April 12, 2012
Filing Date:
March 25, 2011
Export Citation:
Assignee:
QUALCOMM INC (US)
BCHIR OMAR J (US)
BCHIR OMAR J (US)
International Classes:
H01L21/60; H01L23/485
Domestic Patent References:
| WO2005093829A1 | 2005-10-06 |
Foreign References:
| JP2004063516A | 2004-02-26 | |||
| US20030124769A1 | 2003-07-03 | |||
| US20080003780A1 | 2008-01-03 | |||
| JPH06244243A | 1994-09-02 | |||
| US20090085228A1 | 2009-04-02 | |||
| EP2136394A1 | 2009-12-23 | |||
| US20020074637A1 | 2002-06-20 | |||
| US20090218671A1 | 2009-09-03 | |||
| US20070077728A1 | 2007-04-05 | |||
| US6956283B1 | 2005-10-18 | |||
| US20080093424A1 | 2008-04-24 |
Other References:
EMPOWER MATERIALS INC.: "QPAC(R) Binders/Sacrificial Materials for High Quality Products", 9 May 2008 (2008-05-09), XP055014033, Retrieved from the Internet
Attorney, Agent or Firm:
TALPALATSKY, Sam (San Diego, California, US)
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