Title:
METHOD FOR AUTOMATICALLY REMOVING WAVE ARRIVAL OF SEISMIC WAVE
Document Type and Number:
WIPO Patent Application WO/2017/024536
Kind Code:
A1
Abstract:
A method for automatically removing wave arrival of a seismic wave. According to a layer speed and thickness of n layers of a horizontally layered medium, a speed of the kth layer and the thickness of a bottom layer obtained by micro-logging or logging, calculating a cosine value of a critical angle of a refracted wave of the kth layer; substituting the cosine value of the critical angle of the refracted wave into a refracted wave time-distance curve equation of the nth layer (n > 2); solving the refracted wave time-distance curve equation on each refraction layer, so as to obtain wave arrival time of all refracted waves on an offset X, and when X is less than the radius of a blind zone, the value of the wave arrival time of the refracted wave being 0; taking a maximum value therein as a removal value on the offset X; after tXmax values corresponding to all offsets are connected into a line, obtaining an automatic removal line of the refraction wave; and taking the number of layers of a stratum to be n = 2, a stratum model being a low deceleration zone model at this moment, and using a shallow refraction wave method to realize automatic removal of the wave arrival of the seismic wave.
Inventors:
ZHAO LONG (CN)
Application Number:
PCT/CN2015/086684
Publication Date:
February 16, 2017
Filing Date:
August 11, 2015
Export Citation:
Assignee:
SHENZHEN CHAO WEIDA TECH CO LTD (CN)
International Classes:
G01V1/36
Foreign References:
| CN104536048A | 2015-04-22 | |||
| CN1493005A | 2004-04-28 | |||
| US20130238249A1 | 2013-09-12 | |||
| EP0093767B1 | 1988-03-30 |
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