Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD OF BARRIER LAYER SURFACE TREATMENT TO ENABLE DIRECT COPPER PLATING ON BARRIER METAL
Document Type and Number:
WIPO Patent Application WO2005123988
Kind Code:
B1
Abstract:
Embodiments of a method of barrier layer surface treatment to enable direct copper plating without copper seed layer. In one embodiment, a method of plating copper on a substrate with a group VIII metal layer on top comprises pre-treating the substrate surface by removing a group VIII metal surface oxide layer and/or surface contaminants and plating copper on the pre-treated group VIII metal surface. Pre-treating the substrate can be accomplished by annealing the substrate in an environment with a hydrogen-containing gas environment and/or a non-reactive gas(es) to group VIII, by a cathodic treatment in an acid-containing bath, or by immersing the substrate in an acid-containing bath.

Inventors:
SUN ZHI-WEN (US)
HE RENREN (US)
Application Number:
PCT/US2005/019902
Publication Date:
April 06, 2006
Filing Date:
June 07, 2005
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
APPLIED MATERIALS INC (US)
SUN ZHI-WEN (US)
HE RENREN (US)
International Classes:
C25D5/34; C25D7/04; C25D7/12; H01L21/02; H01L21/288; H01L21/768; H01L23/532; (IPC1-7): C25D5/34
Download PDF: