Title:
METHOD FOR BONDING AMORPHOUS ALLOY ELECTRONIC PRODUCT HOUSING AND MIDDLE PLATE
Document Type and Number:
WIPO Patent Application WO/2018/153097
Kind Code:
A1
Abstract:
A method for bonding an amorphous alloy electronic product housing and a middle plate. The method comprises: step I, pre-bonding; step II, heating; step III, applying pressure on the basis of the gravitational effect of the molten state; and step IV, cooling and shaping. Specifically, a convex column structure of an amorphous alloy electronic product housing is heated to above the glass transition temperature, and the heating process is controlled according to a TTT diagram to avoid crystallization reaction of the convex column structure of the amorphous alloy electronic product housing; during bonding, the area of a chamfered structure or a circular concave structure is filled with an amorphous alloy to form an inverted snap-like shape, so as to increase the bonding surface during bonding, thereby enhancing the bonding strength property.
Inventors:
LEE HO DO (CN)
Application Number:
PCT/CN2017/104050
Publication Date:
August 30, 2018
Filing Date:
September 28, 2017
Export Citation:
Assignee:
DONGGUAN PROMETAL TECH CO LTD (CN)
International Classes:
B22D23/06; B22D19/00
Foreign References:
| CN106659008A | 2017-05-10 | |||
| CN106825887A | 2017-06-13 | |||
| CN102430745A | 2012-05-02 | |||
| CN104607611A | 2015-05-13 | |||
| CN101298097A | 2008-11-05 | |||
| CN102921926A | 2013-02-13 |
Attorney, Agent or Firm:
DONGGUAN HUANAN PATENT & TRADEMARK OFFICE CO., LTD. (CN)
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