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Patent Searching and Data


Title:
METHOD FOR BONDING COMPOSITE MATERIALS TOGETHER
Document Type and Number:
WIPO Patent Application WO/2017/187918
Kind Code:
A1
Abstract:
Provided is a method for bonding composite materials together in which bonding regions are suitably put into a semi-cured state and the composite materials are efficiently bonded together while the quality of the bonding strength of the composite materials is suitably maintained. The method for bonding a first composite material and a second composite material together includes the following respective steps. In step S12, a first bonding region of the first composite material is prepared to be maintained in a softened state. In step S14, a first non-bonding region of the first composite material is heated to be put into a cured state. In step S16, the first bonding region is put into a heatable state. In step S18, the first bonding region is heated to be put into a semi-cured state. In step S32, the first bonding region having been put into the semi-cured state is pressed in contact with a second bonding region of the second composite material that becomes a softened state or a semi-cured state. In step S34, the first bonding region and the second bonding region having been brought into contact with each other and pressed in the contacting and pressing step are heated to be put into a cured state.

Inventors:
KAMIHARA NOBUYUKI (JP)
ABE TOSHIO (JP)
Application Number:
PCT/JP2017/014309
Publication Date:
November 02, 2017
Filing Date:
April 06, 2017
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
B29C65/04; B29C70/28
Foreign References:
JPH10128860A1998-05-19
JPS645820A1989-01-10
JPS646507A1989-01-11
JPH0911371A1997-01-14
Other References:
See also references of EP 3434453A4
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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