METHOD FOR BONDING A CONTACT - MITSUBISHI ELECTRIC CORP

Title:

METHOD FOR BONDING A CONTACT

Document Type and Number:

WIPO Patent Application WO/1982/002621

Kind Code:

A1

Abstract:

A method for bonding a contact which includes the steps of measuring at a predetermined interval the distance of the gap between upper and lower electrodes (1), (2) pressing a contact (5) and a rest (6) under constant pressure, and then controlling the current supply between the upper and the lower electrodes (1), (2) after a predetermined interval from when the distance of the gap reaches a maximum value (18). According to this method, the amount of metal melted out externally from the contact interface between the contact (5) and the rest (6) is made constant and the quality of the bond between the contact (5) and the rest (6) is improved and stabilized.

Inventors:

MACHIDA KAZUMICHI (JP)
INADA MIKIO (JP)
INADA YOSHIE (JP)

Application Number:

PCT/JP1982/000013

Publication Date:

August 05, 1982

Filing Date:

January 14, 1982

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP (JP)
MACHIDA KAZUMICHI (JP)
INADA MIKIO (JP)
INADA YOSHIE (JP)

International Classes:

H01H11/06; B23K1/00; B23K11/24; B23K11/25; H01H11/04; (IPC1-7): H03H11/06; B23K11/24

Foreign References:

JPH04211225B

Other References: