Title:
METHOD FOR BONDING DISSIMILAR METALS TO EACH OTHER
Document Type and Number:
WIPO Patent Application WO/2018/074312
Kind Code:
A1
Abstract:
Provided is a method for bonding dissimilar metals to each other, the method comprising: dissimilar metal layer-forming steps (P2), (P3), (P4) for supplying, on the surface of a first material to be bonded that is formed of a first metal, a mixed filler material including a filler material formed of the first metal and particles formed of a second metal having a higher melting point than the first metal, and heating the mixed filler material to a temperature equal to or higher than the melting point of the first metal but equal to or lower than the melting point of the second metal, to form dissimilar metal layers; a second metal layer-forming step (P5) for supplying, on the surface of the dissimilar metal layers, a filler material formed of the second metal, and heating the filler material formed of the second metal to a temperature equal to or higher than the melting point of the second metal, to form a second metal layer formed of the second metal; and a second material-to-be-bonded welding step (P6) for welding a second material to be bonded that is formed of the second metal, onto the second metal layer.
Inventors:
FUJIYA YASUYUKI (JP)
ISHII KEN (JP)
ISHII KEN (JP)
Application Number:
PCT/JP2017/036952
Publication Date:
April 26, 2018
Filing Date:
October 12, 2017
Export Citation:
Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
B23K26/342; B23K9/04; F01D1/06; F01D25/00
Foreign References:
| JP2015055351A | 2015-03-23 | |||
| JPH11315973A | 1999-11-16 | |||
| JPH02224889A | 1990-09-06 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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