Title:
METHOD FOR BONDING LARGE MODULES AND CORRESPONDING BONDING ARRANGEMENT
Document Type and Number:
WIPO Patent Application WO/2018/099515
Kind Code:
A3
Abstract:
The invention relates to a method for bonding large modules comprising the following steps: - a large module is guided from behind to a bonder (1, 2, 3, 4, 5) by means of a guiding unit (6) on a charging plane; - the large module is transferred by the guiding unit (6) to a first transversal guiding unit and moved thereby into a first buffer position in the bonder (1, 2, 3, 4, 5), the first buffer position being on a loading plane of the bonder (1, 2, 3, 4, 5); - the large module is moved on the loading plane using the first transversal guiding unit from the first buffer position into a first transitional position and is transferred to a vertical conveying unit; - the large module is moved vertically by means of the vertical conveying unit and is placed on a bonding plane, the large module on the bonding plane being disposed in sections on a working plane of the bonder; - the large module is machined by a first bonding head and optionally also by a second bonding head, electrically conducting bonding connections being produced on the module; - the large module is moved vertically by the vertical conveying unit from the bonding plane into a second transfer position and in the second transfer position is transferred to a second transversal conveying unit, the second transfer position being on a discharge plane of the bonder; - the large module is moved by the second transversal conveying unit into the second buffer position on the discharge plane; - the large module is transferred from the second buffer position by means of the second transversal conveying unit to an evacuation unit (7).
Inventors:
WALTHER FRANZ (DE)
Application Number:
PCT/DE2017/101020
Publication Date:
September 27, 2018
Filing Date:
November 24, 2017
Export Citation:
Assignee:
HESSE GMBH (DE)
International Classes:
B23K20/00; B23K1/00; B23K20/10; B23K37/00; B23K37/02; B23K37/04; B23K37/047; B23Q7/14; B65G17/00; B65G19/00; H01L21/02; H01L21/677; B23K101/42
Foreign References:
| US6322659B1 | 2001-11-27 | |||
| US5341563A | 1994-08-30 | |||
| US20020025244A1 | 2002-02-28 | |||
| JPS61169412A | 1986-07-31 |
Attorney, Agent or Firm:
TARVENKORN & WICKORD PATENTANWÄLTE PARTNERSCHAFTSGESELLSCHAFT MBB (DE)
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