METHOD FOR BONDING METAL MEMBER AND RESIN MEMBER

Title:

METHOD FOR BONDING METAL MEMBER AND RESIN MEMBER

Document Type and Number:

WIPO Patent Application WO/2012/115010

Kind Code:

A1

Abstract:

A metal member (1) and a resin member (2) are brought into contact without a resin layer being interposed therebetween. A rotation tool (10), while rotating, is inclined and pushed against a surface (1a) of the metal member (1) so that the inclination angle θ of the axis (Q) of the rotation tool (10) relative to a normal line (P) of the surface (1a) of the metal member (1) satisfies the condition 0° <θ ≤ 5°. The metal member (1) is thereby conferred friction energy to bond the metal member (1) and the resin member (2).

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Inventors:

NAGANO YOSHITAKA (JP)
OKADA TOSHIYA (JP)
NAKATA KAZUHIRO (JP)

Application Number:

PCT/JP2012/053839

Publication Date:

August 30, 2012

Filing Date:

February 17, 2012

Export Citation:

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Assignee:

SHOWA DENKO KK (JP)
FURUKAWA SKY ALUMINUM CORP (JP)
UNIV OSAKA (JP)
NAGANO YOSHITAKA (JP)
OKADA TOSHIYA (JP)
NAKATA KAZUHIRO (JP)

International Classes:

B29C65/06; B23K20/12

Foreign References:

JP2010158885A	2010-07-22
JP2003039183A	2003-02-12
JP2003329379A	2003-11-19
JP2006102803A	2006-04-20
JP2007098439A	2007-04-19
JP2008221321A	2008-09-25
JP2009022974A	2009-02-05
JP2009241085A	2009-10-22
JP2009279858A	2009-12-03

Other References: