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Title:
METHOD FOR BONDING METAL POWDER INJECTION MOLDED BODIES
Document Type and Number:
WIPO Patent Application WO/2015/056513
Kind Code:
A1
Abstract:
According to this method for bonding metal powder injection molded bodies, a metal product is produced by: [1] bringing at least two metal powder injection molded bodies, each of which is obtained by kneading a metal powder and a binder and injection molding the kneaded material, into contact with each other; [2] applying a coating agent that contains nitrogen or chlorine to a bond part where the at least two metal powder injection molded bodies are in contact with each other; and [3] bonding the at least two metal powder injection molded bodies with each other at the bond part by means of degreasing or sintering. This bonding method is capable of improving the bonding strength at the bond part.

Inventors:
YOSHIZAWA HIROKI (JP)
SATOH SHIGEYUKI (JP)
TSUNO NOBUYASU (JP)
YONEYAMA NATSUKI (JP)
IKEDA SHUJI (JP)
YOSHINOUCHI TAKASHI (JP)
SATAKE MASAYUKI (JP)
Application Number:
PCT/JP2014/074514
Publication Date:
April 23, 2015
Filing Date:
September 17, 2014
Export Citation:
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Assignee:
IHI CORP (JP)
International Classes:
B22F7/06; B22F3/02; F04D29/54; F04D29/64
Foreign References:
JPH0820808A1996-01-23
JP2006249943A2006-09-21
JPH0711305A1995-01-13
JP2013018228A2013-01-31
JP2009097370A2009-05-07
JP2009019629A2009-01-29
JP2004197622A2004-07-15
JP2010236042A2010-10-21
Other References:
See also references of EP 3059033A4
Attorney, Agent or Firm:
MIYOSHI, Hidekazu et al. (JP)
Hidekazu Miyoshi (JP)
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