METHOD FOR BONDING METALS

WIPO Patent Application WO/2011/152423

A1

The space between a first coating member (14) (copper oxide) covering a first base member (12) (copper) and a second coating member (24) (copper oxide) covering a second base member (22) (copper) is filled with a solution (30), into which the copper oxide of the first coating member (14) and the copper oxide of the second coating member (24) dissolve, and the copper oxide constituting the first coating member (14) and the second coating member (24) is caused to dissolve into the solution (30). A first portion to be bonded (10) and a second portion to be bonded (20) are heated at a relatively low temperature within the range of 200-300˚C, while applying a pressure to the first portion to be bonded (10) and the second portion to be bonded (20) using a pressing machine so that the pressure of the solution (30) is increased, so that components other than copper in the solution (30) are removed, thereby having copper precipitate. Consequently, the first base member (12) and the second base member (22) are bonded with each other by the precipitated copper.

SAITOU Kouichi (5-5, Keihan-Hondori 2-chome, Moriguchi-sh, Osaka 77, 〒5708677, JP)
齊藤　浩一 (〒77 大阪府守口市京阪本通２丁目５番５号三洋電機株式会社内 Osaka, 〒5708677, JP)

JP2011/062535

December 08, 2011

May 31, 2011

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SANYO Electric Co., Ltd. (5-5 Keihan-Hondori 2-chome, Moriguchi-shi Osaka, 77, 〒5708677, JP)
三洋電機株式会社 (〒77 大阪府守口市京阪本通２丁目５番５号 Osaka, 〒5708677, JP)
SAITOU Kouichi (5-5, Keihan-Hondori 2-chome, Moriguchi-sh, Osaka 77, 〒5708677, JP)

B23K20/00; B23K20/24; H01L21/60

KADOYA Hiroshi (5-5, Keihan-Hondori 2-chome, Moriguchi-sh, Osaka 77, 〒5708677, JP)

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