Title:
METHOD FOR BONDING RESIN MOLDED ARTICLES
Document Type and Number:
WIPO Patent Application WO/2018/143274
Kind Code:
A1
Abstract:
Resin molded articles obtained by double molding a thermoplastic crystalline resin composition are connected so as to minimize deformation of the resin molded articles and deformation of a hollow portion and to obtain adequate bonding strength. A bonding method for bonding resin molded articles that comprise a resin composition, wherein vacuum ultraviolet light is radiated onto an irradiation surface 101a on the surface of a first molded article 101 to be bonded with a second molded article 102, the first molded article 101 is disposed in the cavity 31 of a mold 30, and resin is injected into the cavity 31 so that the second molded article 102 is bonded and molded to the irradiation surface 101a of the first molded article 101.
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Inventors:
GONDA MITSUHIRO (JP)
Application Number:
PCT/JP2018/003221
Publication Date:
August 09, 2018
Filing Date:
January 31, 2018
Export Citation:
Assignee:
POLYPLASTICS CO (JP)
International Classes:
B29C45/14; B29C45/26; B29L9/00
Domestic Patent References:
| WO2015152364A1 | 2015-10-08 | |||
| WO2012144408A1 | 2012-10-26 |
Foreign References:
| JP2015051542A | 2015-03-19 | |||
| JP2008019348A | 2008-01-31 | |||
| JP2006187730A | 2006-07-20 | |||
| JP2001170955A | 2001-06-26 |
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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