Title:
METHOD OF BONDING RESINS BY LIGHT IRRADIATION AND PROCESS FOR PRODUCING RESIN ARTICLE
Document Type and Number:
WIPO Patent Application WO/2008/007787
Kind Code:
A1
Abstract:
A bonding method by which a resin can be bonded to another resin at a lower temperature
than in thermal fusion bonding with satisfactory productivity. The method of
resin bonding, which is for bonding a first resin to a second resin, comprises
a step (I) in which those surfaces of the first and second resins which are bonding
surfaces are irradiated with ultraviolet and a step (II) in which the resins are
heated while keeping the irradiated surfaces in contact with each other to thereby
bond the first resin to the second resin, with those surfaces used as bonding surfaces.
This bonding method can be applied, for example, to a process for producing a resin
article comprising two or more parts which each has a resinous area and which have
been bonded to each other at the resinous areas, and to a process for producing
a microchip comprising a pair of resin substrates bonded to each other face-to-face,
at least one of the resin substrates having a fine channel formed therein.
Inventors:
SUGIMURA, Hiroyuki (KYOTO UNIVERSITY Yoshida-honmachi, Sakyo-ku, Kyoto-sh, Kyoto 01, 6068501, JP)
杉村博之 (〒01 京都府京都市左京区吉田本町国立大学法人京都大学大学院工学研究科内 Kyoto, 6068501, JP)
LEE, Kyung-Hwang (KYOTO UNIVERSITY Yoshida-honmachi, Sakyo-ku, Kyoto-sh, Kyoto 01, 6068501, JP)
李庚晃 (〒01 京都府京都市左京区吉田本町国立大学法人京都大学大学院工学研究科内 Kyoto, 6068501, JP)
杉村博之 (〒01 京都府京都市左京区吉田本町国立大学法人京都大学大学院工学研究科内 Kyoto, 6068501, JP)
LEE, Kyung-Hwang (KYOTO UNIVERSITY Yoshida-honmachi, Sakyo-ku, Kyoto-sh, Kyoto 01, 6068501, JP)
李庚晃 (〒01 京都府京都市左京区吉田本町国立大学法人京都大学大学院工学研究科内 Kyoto, 6068501, JP)
Application Number:
JP2007/064023
Publication Date:
January 17, 2008
Filing Date:
July 13, 2007
Export Citation:
Assignee:
KYOTO UNIVERSITY (36-1, Yoshida-honmachi Sakyo-ku, Kyoto-sh, Kyoto 01, 6068501, JP)
国立大学法人京都大学 (〒01 京都府京都市左京区吉田本町３６番地１ Kyoto, 6068501, JP)
ALPS ELECTRIC CO., LTD. (1-7 Yukigaya-Otsuka-cho, Ota-ku Tokyo, 01, 1458501, JP)
アルプス電気株式会社 (〒01 東京都大田区雪谷大塚町１番７号 Tokyo, 1458501, JP)
SUGIMURA, Hiroyuki (KYOTO UNIVERSITY Yoshida-honmachi, Sakyo-ku, Kyoto-sh, Kyoto 01, 6068501, JP)
杉村博之 (〒01 京都府京都市左京区吉田本町国立大学法人京都大学大学院工学研究科内 Kyoto, 6068501, JP)
国立大学法人京都大学 (〒01 京都府京都市左京区吉田本町３６番地１ Kyoto, 6068501, JP)
ALPS ELECTRIC CO., LTD. (1-7 Yukigaya-Otsuka-cho, Ota-ku Tokyo, 01, 1458501, JP)
アルプス電気株式会社 (〒01 東京都大田区雪谷大塚町１番７号 Tokyo, 1458501, JP)
SUGIMURA, Hiroyuki (KYOTO UNIVERSITY Yoshida-honmachi, Sakyo-ku, Kyoto-sh, Kyoto 01, 6068501, JP)
杉村博之 (〒01 京都府京都市左京区吉田本町国立大学法人京都大学大学院工学研究科内 Kyoto, 6068501, JP)
International Classes:
C09J5/02; B29C65/02; B29C65/14; B32B27/00; B32B27/36; C08J5/12; C09J5/06; C12M1/00
Attorney, Agent or Firm:
KAMADA, Koichi (7th Fl, TOMOE MARION BLDG.4-3-1, Nishitenma, Kita-ku,Osaka-sh, Osaka 47, 5300047, JP)
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