Title:
METHOD FOR BONDING SUBSTRATES TOGETHER, AND SUBSTRATE BONDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/060274
Kind Code:
A1
Abstract:
[Problem] To bond substrates together so that voids are prevented from forming between the substrates, strain is minimized, and bonding is performed at a high positional accuracy. [Solution] A method for bonding a first substrate and a second substrate together, wherein the method is provided with: a step for performing a hydrophilic treatment in which water or an OH-containing substance is caused to adhere to the surface of the respective bonding surface of the first substrate and the second substrate; a step for disposing the first substrate and the second substrate so that the bonding surfaces face each other, and causing the first substrate to deflect so that the center part protrudes towards the second substrate side in relation to the outer peripheral part of the bonding surface; a step for causing the bonding surface of the first substrate and the bonding surface of the second substrate to abut each other at the center parts; and an abutting step for causing the distance between the outer peripheral part of the first substrate and the outer peripheral part of the second substrate to be reduced once the center parts have been caused to abut each other at a pressure at which a non-bonding state is maintained, and causing the bonding surface of the first substrate and the bonding surface of the second substrate to abut each other across the entire surface.
More Like This:
Inventors:
YAMAUCHI AKIRA (JP)
Application Number:
PCT/JP2015/079446
Publication Date:
April 21, 2016
Filing Date:
October 19, 2015
Export Citation:
Assignee:
BONDTECH CO LTD (JP)
International Classes:
H01L21/02; B23K20/00; B23K20/16; B23K20/24; H01L21/68; H01L21/683
Domestic Patent References:
| WO2014156987A1 | 2014-10-02 |
Foreign References:
| JP2013258377A | 2013-12-26 | |||
| JP2011249643A | 2011-12-08 | |||
| JP2005142537A | 2005-06-02 |
Other References:
See also references of EP 3208828A4
Attorney, Agent or Firm:
SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)
Sonoda and the Kobayashi patent business corporation (JP)
Sonoda and the Kobayashi patent business corporation (JP)
Download PDF: