Title:
METHOD FOR BONDING TWO SUBSTRATES AND DEVICE FOR BONDING TWO SUBSTRATES
Document Type and Number:
WIPO Patent Application WO/2017/033545
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a method for bonding two substrates and a device for bonding two substrates, enabling a first substrate and a second substrate to bond via a functional film so as not to make direct contact with each other except for via the functional film. The method for bonding two substrates according to the present invention is for bonding, via a functional film having a specified peripheral shape, a second substrate and a first substrate having the functional film formed on the surface thereof, and is characterized by including: an ultraviolet ray irradiation step for irradiating, with ultraviolet rays under vacuum, the surface of the functional film formed on the surface of the first substrate; a stacking step for stacking the second substrate and the first substrate, which have undergone the ultraviolet ray irradiation step, such that the surface of the functional film and a bonding surface of the second substrate are in contact with each other; and a pressure application step for applying, in the thickness direction, pressure on a stacked body of the first substrate and the second substrate obtained through the stacking step such that pressure is applied selectively on the portion where the functional film and the second substrate make contact with each other.
Inventors:
YOSHIHARA KEITA (JP)
TAKEMOTO FUMITOSHI (JP)
WASAMOTO MAKOTO (JP)
SUZUKI SHINJI (JP)
TAKEMOTO FUMITOSHI (JP)
WASAMOTO MAKOTO (JP)
SUZUKI SHINJI (JP)
Application Number:
PCT/JP2016/068227
Publication Date:
March 02, 2017
Filing Date:
June 20, 2016
Export Citation:
Assignee:
USHIO ELECTRIC INC (JP)
International Classes:
B32B37/10; B32B7/04; C09J5/00; C09J5/02
Foreign References:
| JP2013242756A | 2013-12-05 | |||
| JP2009028922A | 2009-02-12 | |||
| JP2009035719A | 2009-02-19 | |||
| JP2010278228A | 2010-12-09 | |||
| JP2011235559A | 2011-11-24 | |||
| JP2009074002A | 2009-04-09 | |||
| JP2009132749A | 2009-06-18 |
Attorney, Agent or Firm:
OHI, Masahiko (JP)
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