Title:
METHOD OF BONDING WATERPROOF FABRICS
Document Type and Number:
WIPO Patent Application WO/2000/009795
Kind Code:
A1
Abstract:
A method of bonding waterproof fabrics comprising the steps of disposing a hot melt resin bonding material layer between the waterproof fabrics, waterproofed with a resin film, sewing them together, clamping the sewn portion between a set of metal electrodes curved in an arcuate form, and fusing the hot melt resin adhesive by radio frequency heating to bond the fabrics. This bonding method can uniformly bond the sewn portion even when the sewn portion is curved within a plane or is curved three-dimensionally or the thickness of the sewn portion is partially different, such as a collar stitching portion, a sleeve stitching portion, a crotch portion of clothes, and can impart excellent waterproofness to the overall sewn portion. Further, the sewn portion of a sewn article has high bonding strength but does not become rigid.
Inventors:
YASUE MASAHARU
KAMIYA MASAMI
KAMIYA MASAMI
Application Number:
PCT/JP1998/005665
Publication Date:
February 24, 2000
Filing Date:
December 15, 1998
Export Citation:
Assignee:
ASAHI CHEMICAL IND (JP)
International Classes:
D05B1/26; A41D27/24; A43B7/12; B29C65/00; B29C65/04; B29C65/40; B29C65/72; D06H5/00; B29C65/50; B29C65/62; B29L7/00; B29L9/00; (IPC1-7): D06H5/00
Foreign References:
| JPH0892868A | 1996-04-09 | |||
| JPS53139870A | 1978-12-06 | |||
| JPS59120101A | 1984-07-11 | |||
| JPH10104796A | 1998-04-24 |
Other References:
See also references of EP 1120489A4
Attorney, Agent or Firm:
Ishida, Takashi (Toranomon 3-chome Minato-ku Tokyo, JP)
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