METHOD FOR BONDING WORK AND APPARATUS FOR BONDING WORK

WIPO Patent Application WO/2012/144408

A1

Two workpieces composed of a resin workpiece and a resin workpiece, or two workpieces composed of a resin workpiece and a glass substrate are bonded to each other such that troubles, such as an alignment shift and breakage, are not generated, while ensuring bonding uniformity. A first workpiece (W1) is placed on an inverting stage (31) of an inverting stage unit (30), a second workpiece (W2) is placed on a work stage (21) of a pressurizing stage unit (20), and UV light is radiated from a light irradiation unit (10). Then, the inverting stage (31) is inverted 180°, the workpieces (W1, W2) are overlapped each other on the work stage (21), and the workpieces (W1, W2) are pressurized and pre-bonded to each other. Then, the workpieces in the pre-bonded state are transferred to a heating stage by means of a transfer means, the temperature of the workpieces is increased to a predetermined temperature by heating the workpieces by means of a heating mechanism, and the temperature is maintained until bonding is completed.

YOSHIHARA KEITA (JP)
SUZUKI SHINJI (JP)
MORITA KINICHI (JP)
FUJITSUGU HIDEKI (JP)

PCT/JP2012/059990

October 26, 2012

April 12, 2012

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USHIO ELECTRIC INC (JP)
YOSHIHARA KEITA (JP)
SUZUKI SHINJI (JP)
MORITA KINICHI (JP)
FUJITSUGU HIDEKI (JP)

B01J19/00; B29C65/02; B32B17/10; B32B27/00; B32B37/10; B81C3/00; G01N37/00

WO2008087800A1

2008-07-24

JP2009023337A	2009-02-05
JP2006187730A	2006-07-20
JP2008019348A	2008-01-31

NAGASAWA Shunichirou (JP)
Shunichiro Nagasawa (JP)

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