Title:
METHOD FOR BREAKING BRITTLE MATERIAL SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2011/096388
Kind Code:
A1
Abstract:
Provided is a breaking method by which an end surface strength can be stronger. A method for breaking a brittle material substrate comprises a step for forming a scribe line on the brittle material substrate, and a breaking step for breaking along the scribe line. In the breaking step, a break roller is pressed on and applies a load to the brittle material substrate placed on a table by rolling the break roller near the scribe line along a position separate from the scribe line to one side, so as to fold at a low load and divide the substrate.
Inventors:
Ichikawa Katsunori (2-12-12, Minami-Kaneden, Suita-cit, Osaka 44, 〒5640044, JP)
Application Number:
JP2011/052012
Publication Date:
August 11, 2011
Filing Date:
February 01, 2011
Export Citation:
Assignee:
Mitsuboshi Diamond Industrial Co., Ltd. (2-12-12, Minami-Kaneden Suita-cit, Osaka 44, 〒5640044, JP)
三星ダイヤモンド工業株式会社 (〒44 大阪府吹田市南金田２丁目１２番１２号 Osaka, 〒5640044, JP)
三星ダイヤモンド工業株式会社 (〒44 大阪府吹田市南金田２丁目１２番１２号 Osaka, 〒5640044, JP)
International Classes:
B28D5/00; B28D1/24; C03B33/033; G02F1/1333
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Claims: