Title:
METHOD FOR BREAKING BRITTLE MATERIAL SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2011/096388
Kind Code:
A1
Abstract:
Provided is a breaking method by which an end surface strength can be stronger. A method for breaking a brittle material substrate comprises a step for forming a scribe line on the brittle material substrate, and a breaking step for breaking along the scribe line. In the breaking step, a break roller is pressed on and applies a load to the brittle material substrate placed on a table by rolling the break roller near the scribe line along a position separate from the scribe line to one side, so as to fold at a low load and divide the substrate.
Inventors:
ICHIKAWA KATSUNORI (JP)
Application Number:
PCT/JP2011/052012
Publication Date:
August 11, 2011
Filing Date:
February 01, 2011
Export Citation:
Assignee:
MITSUBOSHI DIAMOND IND CO LTD (JP)
ICHIKAWA KATSUNORI (JP)
ICHIKAWA KATSUNORI (JP)
International Classes:
B28D5/00; B28D1/24; C03B33/033; G02F1/1333
Domestic Patent References:
| WO2004073946A1 | 2004-09-02 |
Foreign References:
| JPH09286628A | 1997-11-04 | |||
| JP2006289625A | 2006-10-26 | |||
| JPH07138039A | 1995-05-30 |
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Claims: